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  • 10:54 AM, Sunday, 19 Jan 2020


Course Postgraduate
Semester Electives
Subject Code AVM862
Subject Title Microsystem Integration

Syllabus

MEMS Foundry processes, CMOS-MEMS Integration: Design and technology,
Bonding & Packaging of MEMS, MEMS reliability, non-silicon MEMS,
Interface electronics for sense and drive in microsystems, , MEMS and circuit noise
sources, Noise and Offset Cancellation Technique, testing and calibration approaches
in integrated microsystems.
MEMS Sensors and Actuators: Case Studies (Mechanical, Inertial, bio/chemical,
Microfluidics, RF Applications.); Future Directions and developments (Integrated
Nano-Electro-Mechanical Systems (NEMS), NEMS oscillators and sensors)

Text Books

Same as Reference

References

1. S. D. Senturia, Microsystem Design (2005 edition)
2. Baltes, Brand, Fedder, Hierold, Kowenk, Tabata, Advanced Micro and Nanosystems, Vol. 1, Enabling Technology for MEMS and Nanodevices,Wiley- VCH, 2004.
3. Gray, Hurst, Lewis, & Meyer, Analysis and Design of Analog Integrated Circuits (4th edition), Wiley, 2004.
4. Marc Madau, Fundamentals of Microfabrication Science of Miniaturization, CRC Press
5. G. K. Ananthasuresh , K. J. Vinoy, S. Gopalakrishnan, K. N. Bhat , V. K. Aatre Micro and Smart Systems Technology and Modeling (January 2012)
Peer reviewed international journals such as IEEE/ASME Journal of MEMS, IOP Journal of Micromechanics and Microengineering, IOP Journal of Nanotechnology, Elseivier Sensors and Actuators etc. and conference proceedings such as IEEE MEMS, IEEE Nanotechnology, Transducers etc..